--- title: 2024 IEEE Electronic Components and Technology... description: The 2024 IEEE Electronic Components and Technology Conference (ECTC) will feature cutting-edge microelectronics packaging technologies, including topics such... canonical: https://daily.dev/posts/2024-ieee-electronic-components-and-technology-conference-to-spotlight-cutting-edge-microelectronics-kiz3id3ln twitter:card: summary_large_image twitter:site: @dailydotdev og:type: website og:site_name: daily.dev og:title: 2024 IEEE Electronic Components and Technology Conference to Spotlight Cutting-Edge Microelectronics Packaging Technologies; Photonic Devices, Heterogeneous Integration Among Key Topics | daily.dev og:description: The 2024 IEEE Electronic Components and Technology Conference (ECTC) will feature cutting-edge microelectronics packaging technologies, including topics such... og:url: https://daily.dev/posts/2024-ieee-electronic-components-and-technology-conference-to-spotlight-cutting-edge-microelectronics-kiz3id3ln og:image: https://api.daily.dev/og/posts/kiZ3id3ln.png og:image:alt: 2024 IEEE Electronic Components and Technology Conference to Spotlight Cutting-Edge Microelectronics Packaging Technologies; Photonic Devices, Heterogeneous Integration Among Key Topics og:image:width: 1200 og:image:height: 630 og:locale: en --- [The Quantum Insider](https://daily.dev/sources/thequantuminsider) [Read post](https://api.daily.dev/r/kiZ3id3ln) # [2024 IEEE Electronic Components and Technology Conference to Spotlight Cutting-Edge Microelectronics Packaging Technologies; Photonic Devices, Heterogeneous Integration Among Key Topics](https://api.daily.dev/r/kiZ3id3ln "Go to post") The 2024 IEEE Electronic Components and Technology Conference (ECTC) will feature cutting-edge microelectronics packaging technologies, including topics such as heterogeneous integration, photonics, components, materials, assembly, and more. The conference will take place on May 28-31, 2024 in Denver, Colorado. [#assembly](/tags/assembly "Check all #assembly posts") May 02, 2024•3m read time•From [thequantuminsider.com](https://api.daily.dev/r/kiZ3id3ln "thequantuminsider.com") [](https://api.daily.dev/r/kiZ3id3ln "Go to post") 56 Impressions Comment Bookmark Copy Share your thoughtsPost [](https://daily.dev/sources/thequantuminsider) [The Quantum Insider](https://daily.dev/sources/thequantuminsider "https://daily.dev/sources/thequantuminsider") The Quantum Insider provides news, updates, and insights into the field of quantum computing. Reader... Read more 672 Followers • 464 Upvotes #### Would you recommend this post? Copy link WhatsApp Facebook X New Squad Copy linkShare with your friends ```json {"@context":"https://schema.org","@graph":[{"@type":"Organization","@id":"https://daily.dev/#organization","name":"daily.dev","url":"https://daily.dev","logo":{"@type":"ImageObject","url":"https://daily.dev/apple-touch-icon.png","width":180,"height":180},"sameAs":["https://twitter.com/dailydotdev","https://github.com/dailydotdev","https://www.linkedin.com/company/daily-dev-ltd"]},{"@type":"WebSite","@id":"https://daily.dev/#website","url":"https://daily.dev","name":"daily.dev","publisher":{"@id":"https://daily.dev/#organization"},"potentialAction":{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https://daily.dev/search?q={search_term_string}"},"query-input":"required name=search_term_string"}}]} {"@context":"https://schema.org","@type":"TechArticle","headline":"2024 IEEE Electronic Components and Technology Conference to Spotlight Cutting-Edge Microelectronics Packaging Technologies; Photonic Devices, Heterogeneous Integration Among Key Topics","url":"https://daily.dev/posts/2024-ieee-electronic-components-and-technology-conference-to-spotlight-cutting-edge-microelectronics-kiz3id3ln","mainEntityOfPage":{"@type":"WebPage","@id":"https://daily.dev/posts/2024-ieee-electronic-components-and-technology-conference-to-spotlight-cutting-edge-microelectronics-kiz3id3ln"},"datePublished":"2024-05-02T12:21:54.704Z","dateModified":"2024-08-02T02:12:37.232Z","description":"The 2024 IEEE Electronic Components and Technology Conference (ECTC) will feature cutting-edge microelectronics packaging technologies, including topics such...","image":"https://media.daily.dev/image/upload/f_auto,q_auto/v1/posts/9c5ab0a5c297d518b041b4c49352511a?_a=AQAEuiZ","thumbnailUrl":"https://media.daily.dev/image/upload/f_auto,q_auto/v1/posts/9c5ab0a5c297d518b041b4c49352511a?_a=AQAEuiZ","isAccessibleForFree":true,"articleSection":"The Quantum Insider","inLanguage":"en","publisher":{"@type":"Organization","name":"daily.dev","url":"https://daily.dev","logo":{"@type":"ImageObject","url":"https://daily.dev/apple-touch-icon.png","width":180,"height":180}},"author":{"@type":"Organization","name":"The Quantum Insider","logo":"https://media.daily.dev/image/upload/t_logo,f_auto/v1/logos/7b14a6b34c1b464c9e8a88d9a0dac951","url":"https://daily.dev/sources/thequantuminsider"},"commentCount":0,"discussionUrl":"https://daily.dev/posts/2024-ieee-electronic-components-and-technology-conference-to-spotlight-cutting-edge-microelectronics-kiz3id3ln","interactionStatistic":[{"@type":"InteractionCounter","interactionType":{"@type":"LikeAction"},"userInteractionCount":0},{"@type":"InteractionCounter","interactionType":{"@type":"CommentAction"},"userInteractionCount":0}],"keywords":"assembly","timeRequired":"PT3M"} {"@context":"https://schema.org","@type":"BreadcrumbList","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https://daily.dev"},{"@type":"ListItem","position":2,"name":"The Quantum Insider","item":"https://daily.dev/sources/thequantuminsider"},{"@type":"ListItem","position":3,"name":"2024 IEEE Electronic Components and Technology Conference to Spotlight Cutting-Edge Microelectronics Packaging Technologies; Photonic Devices, Heterogeneous Integration Among Key Topics"}]} ```