--- title: 2024 IEEE Electronic Components and Technology... description: The 2024 IEEE Electronic Components and Technology Conference (ECTC) will feature cutting-edge microelectronics packaging technologies, including topics such... canonical: https://daily.dev/posts/2024-ieee-electronic-components-and-technology-conference-to-spotlight-cutting-edge-microelectronics-kiz3id3ln twitter:card: summary_large_image twitter:site: @dailydotdev og:type: website og:site_name: daily.dev og:title: 2024 IEEE Electronic Components and Technology Conference to Spotlight Cutting-Edge Microelectronics Packaging Technologies; Photonic Devices, Heterogeneous Integration Among Key Topics | daily.dev og:description: The 2024 IEEE Electronic Components and Technology Conference (ECTC) will feature cutting-edge microelectronics packaging technologies, including topics such... og:url: https://daily.dev/posts/2024-ieee-electronic-components-and-technology-conference-to-spotlight-cutting-edge-microelectronics-kiz3id3ln og:image: https://api.daily.dev/og/posts/kiZ3id3ln.png og:image:alt: 2024 IEEE Electronic Components and Technology Conference to Spotlight Cutting-Edge Microelectronics Packaging Technologies; Photonic Devices, Heterogeneous Integration Among Key Topics og:image:width: 1200 og:image:height: 630 og:locale: en --- > ## Documentation Index > Fetch the complete documentation index at: https://daily.dev/llms.txt > Use this file to discover all available pages before exploring further. # 2024 IEEE Electronic Components and Technology Conference to Spotlight Cutting-Edge Microelectronics Packaging Technologies; Photonic Devices, Heterogeneous Integration Among Key Topics **[The Quantum Insider](https://daily.dev/sources/thequantuminsider)** · 3 min read · 0 upvotes · 0 comments ## Summary The 2024 IEEE Electronic Components and Technology Conference (ECTC) will feature cutting-edge microelectronics packaging technologies, including topics such as heterogeneous integration, photonics, components, materials, assembly, and more. The conference will take place on May 28-31, 2024 in Denver, Colorado. ## Full article daily.dev links to this article rather than hosting it. Read it at the original source: ## Similar posts on daily.dev - [Don’t just attend KubeCon \+ CloudNativeCon, Merge Forward your experience\!](https://daily.dev/posts/don-t-just-attend-kubecon-cloudnativecon-merge-forward-your-experience--l0rpp73x8) · CNCF · 1 upvotes · 0 comments - [Announcing H2 2026 KCDs](https://daily.dev/posts/announcing-h2-2026-kcds-m96goajm1) · CNCF · 1 upvotes · 0 comments - [Two months of Open Community Groups](https://daily.dev/posts/two-months-of-open-community-groups-asf52zhbs) · CNCF · 0 upvotes · 0 comments --- Tags: [#assembly](https://daily.dev/tags/assembly) [View this post on daily.dev](https://daily.dev/posts/2024-ieee-electronic-components-and-technology-conference-to-spotlight-cutting-edge-microelectronics-kiz3id3ln) ```json {"@context":"https://schema.org","@graph":[{"@type":"Organization","@id":"https://daily.dev/#organization","name":"daily.dev","url":"https://daily.dev","logo":{"@type":"ImageObject","url":"https://daily.dev/apple-touch-icon.png","width":180,"height":180},"sameAs":["https://twitter.com/dailydotdev","https://github.com/dailydotdev","https://www.linkedin.com/company/daily-dev-ltd"]},{"@type":"WebSite","@id":"https://daily.dev/#website","url":"https://daily.dev","name":"daily.dev","publisher":{"@id":"https://daily.dev/#organization"},"potentialAction":{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https://daily.dev/search?q={search_term_string}"},"query-input":"required name=search_term_string"}}]} {"@context":"https://schema.org","@type":"TechArticle","headline":"2024 IEEE Electronic Components and Technology Conference to Spotlight Cutting-Edge Microelectronics Packaging Technologies; Photonic Devices, Heterogeneous Integration Among Key Topics","url":"https://daily.dev/posts/2024-ieee-electronic-components-and-technology-conference-to-spotlight-cutting-edge-microelectronics-kiz3id3ln","mainEntityOfPage":{"@type":"WebPage","@id":"https://daily.dev/posts/2024-ieee-electronic-components-and-technology-conference-to-spotlight-cutting-edge-microelectronics-kiz3id3ln"},"datePublished":"2024-05-02T12:21:54.704Z","dateModified":"2024-08-02T02:12:37.232Z","description":"The 2024 IEEE Electronic Components and Technology Conference (ECTC) will feature cutting-edge microelectronics packaging technologies, including topics such...","image":"https://media.daily.dev/image/upload/f_auto,q_auto/v1/posts/9c5ab0a5c297d518b041b4c49352511a?_a=AQAEuiZ","thumbnailUrl":"https://media.daily.dev/image/upload/f_auto,q_auto/v1/posts/9c5ab0a5c297d518b041b4c49352511a?_a=AQAEuiZ","isAccessibleForFree":true,"articleSection":"The Quantum Insider","inLanguage":"en","publisher":{"@type":"Organization","name":"daily.dev","url":"https://daily.dev","logo":{"@type":"ImageObject","url":"https://daily.dev/apple-touch-icon.png","width":180,"height":180}},"author":{"@type":"Organization","name":"The Quantum Insider","logo":"https://media.daily.dev/image/upload/t_logo,f_auto/v1/logos/7b14a6b34c1b464c9e8a88d9a0dac951","url":"https://daily.dev/sources/thequantuminsider"},"commentCount":0,"discussionUrl":"https://daily.dev/posts/2024-ieee-electronic-components-and-technology-conference-to-spotlight-cutting-edge-microelectronics-kiz3id3ln","interactionStatistic":[{"@type":"InteractionCounter","interactionType":{"@type":"LikeAction"},"userInteractionCount":0},{"@type":"InteractionCounter","interactionType":{"@type":"CommentAction"},"userInteractionCount":0}],"keywords":"assembly","timeRequired":"PT3M"} {"@context":"https://schema.org","@type":"BreadcrumbList","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https://daily.dev"},{"@type":"ListItem","position":2,"name":"The Quantum Insider","item":"https://daily.dev/sources/thequantuminsider"},{"@type":"ListItem","position":3,"name":"2024 IEEE Electronic Components and Technology Conference to Spotlight Cutting-Edge Microelectronics Packaging Technologies; Photonic Devices, Heterogeneous Integration Among Key Topics"}]} ```