--- title: China just closed a gap in chipmaking that nobody talks... description: Hwatsing Technology announced China's first metrology system integrated with CMP (chemical mechanical polishing) equipment for six-inch wafers. The system... canonical: https://daily.dev/posts/china-just-closed-a-gap-in-chipmaking-that-nobody-talks-about-the-wafer-size-tells-you-how-far-it-h-py3pkmxpx twitter:card: summary_large_image twitter:site: @dailydotdev og:type: website og:site_name: daily.dev og:title: China just closed a gap in chipmaking that nobody talks about. The wafer size tells you how far it has to go. | daily.dev og:description: Hwatsing Technology announced China's first metrology system integrated with CMP (chemical mechanical polishing) equipment for six-inch wafers. The system... og:url: https://daily.dev/posts/china-just-closed-a-gap-in-chipmaking-that-nobody-talks-about-the-wafer-size-tells-you-how-far-it-h-py3pkmxpx og:image: https://api.daily.dev/og/posts/pY3PKmXPX.png og:image:alt: China just closed a gap in chipmaking that nobody talks about. The wafer size tells you how far it has to go. og:image:width: 1200 og:image:height: 630 og:locale: en --- > ## Documentation Index > Fetch the complete documentation index at: https://daily.dev/llms.txt > Use this file to discover all available pages before exploring further. # China just closed a gap in chipmaking that nobody talks about. The wafer size tells you how far it has to go. **[The Next Web](https://daily.dev/sources/tnw)** · 4 min read · 0 upvotes · 0 comments ## Summary Hwatsing Technology announced China's first metrology system integrated with CMP (chemical mechanical polishing) equipment for six-inch wafers. The system measures wafers before and after polishing and feeds live data back to the control system, improving yield. However, the six-inch (150mm) format is well behind the 300mm wafers used in leading-edge logic. Hwatsing's market share in CMP equipment grew from ~1.5% in 2022 to ~11% in 2023, and the company shipped its 1,000th CMP system in April. It is raising up to $552 million to expand capacity and fund high-end tool development. The broader context: polishing tools are not the binding constraint — ASML's EUV machines remain inaccessible to China, and China's semiconductor equipment self-sufficiency sits at roughly 35%. Beijing's strategy is to close every achievable gap while the hardest one (EUV lithography) remains shut. ## Full article daily.dev links to this article rather than hosting it. Read it at the original source: ## Questions this post answers ### What is China's share of the global CMP equipment market and which company drives it? China's share of the global CMP equipment market rose from roughly 1.5% in 2022 to almost 11% in 2023, with Hwatsing Technology responsible for most of that gain. Applied Materials still leads the market decisively, and Ebara holds roughly 27% globally, making Hwatsing's 11% a real but non-dominant position. _Engineers tracking semiconductor supply chain shifts follow developments like these on daily.dev._ ### What wafer size do leading-edge logic chips use compared to mature nodes? Leading-edge logic chips run on 300mm wafers, where sub-10nm nodes are produced. The 150mm (six-inch) format belongs to mature nodes and compound semiconductors. Silicon carbide power devices are already migrating from 150mm to 200mm in volume manufacturing, while gallium nitride is moving from 200mm toward 300mm. _Semiconductor engineers navigating node transitions and equipment choices keep up with industry moves on daily.dev._ ### How far has China progressed on semiconductor equipment self-sufficiency? Chinese semiconductor equipment self-sufficiency has reportedly reached around 35%, up from roughly 25% two years earlier. The binding constraint remains EUV lithography — ASML is the only company making EUV machines and China cannot purchase them under US-led export controls. China's homegrown immersion DUV effort, Shanghai Aishengna, has been named but carries heavy analyst caveats. _Those watching the US-China chip competition find the latest signals aggregated on daily.dev._ ## Similar posts on daily.dev - [Records Fall for 3D Chip Tech](https://daily.dev/posts/records-fall-for-3d-chip-tech-aoqzhvjwz) · IEEE Spectrum · 0 upvotes · 0 comments - [UBS says China is unlikely to match ASML’s top tool this decade](https://daily.dev/posts/ubs-says-china-is-unlikely-to-match-asml-s-top-tool-this-decade-pz2nvde07) · The Next Web · 0 upvotes · 0 comments --- [View this post on daily.dev](https://daily.dev/posts/china-just-closed-a-gap-in-chipmaking-that-nobody-talks-about-the-wafer-size-tells-you-how-far-it-h-py3pkmxpx) ```json {"@context":"https://schema.org","@graph":[{"@type":"Organization","@id":"https://daily.dev/#organization","name":"daily.dev","url":"https://daily.dev","logo":{"@type":"ImageObject","url":"https://daily.dev/apple-touch-icon.png","width":180,"height":180},"sameAs":["https://twitter.com/dailydotdev","https://github.com/dailydotdev","https://www.linkedin.com/company/daily-dev-ltd"]},{"@type":"WebSite","@id":"https://daily.dev/#website","url":"https://daily.dev","name":"daily.dev","publisher":{"@id":"https://daily.dev/#organization"},"potentialAction":{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https://daily.dev/search?q={search_term_string}"},"query-input":"required name=search_term_string"}}]} {"@context":"https://schema.org","@type":"TechArticle","headline":"China just closed a gap in chipmaking that nobody talks about. 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