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title: Congatec Launches Ryzen AI-based COM-HPC Module | daily.dev
description: Congatec has launched the conga-HPC/cRX1, a COM-HPC Client Size C module (120×160 mm) powered by AMD Ryzen AI Embedded X100 Series processors. Targeting...
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og:description: Congatec has launched the conga-HPC/cRX1, a COM-HPC Client Size C module (120×160 mm) powered by AMD Ryzen AI Embedded X100 Series processors. Targeting...
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# Congatec Launches Ryzen AI-based COM-HPC Module

**[Embedded.com](https://daily.dev/sources/embedded-com)** · 3 min read · 1 upvotes · 0 comments

## Summary

Congatec has launched the conga-HPC/cRX1, a COM-HPC Client Size C module (120×160 mm) powered by AMD Ryzen AI Embedded X100 Series processors. Targeting physical AI applications at the rugged edge, it features up to 16 Zen 5 CPU cores, an AMD Radeon RDNA 3.5 GPU delivering up to 59 TOPS INT8 inference and 29.7 TFLOPS FP32, plus a dedicated NPU with up to 50 TOPS. The module operates across an industrial temperature range of -40°C to 85°C, supports TDP configurations from 45 W to 120 W, and offers extensive I/O including 24 PCIe Gen4 lanes and 2×2.5 GbE. It is designed to IEC 62443-4-1 cybersecurity standards and supports Windows 11, Linux, and several preconfigured OS options. Target use cases include robotics, autonomous vehicles, medical technology, and industrial automation.

## Full article

daily.dev links to this article rather than hosting it. Read it at the original source: <https://www.embedded.com/congatec-launches-ryzen-ai-based-com-hpc-module>

## Questions this post answers

### What AI performance does the AMD Ryzen AI Embedded X100 series offer in the congatec conga-HPC/cRX1 module?

The conga-HPC/cRX1 module delivers up to 59 TOPS of dense INT8 AI inference performance and 29.7 TFLOPS of FP32 compute from its integrated AMD Radeon RDNA 3.5 GPU, plus up to 50 TOPS from a dedicated NPU for always-on tasks like object detection and speech recognition. It also supports up to 16 Zen 5 CPU cores for real-time control and sensor fusion.

_Engineers evaluating edge AI hardware options can follow module comparisons like this on daily.dev._

### What temperature range and power envelope does the congatec conga-HPC/cRX1 COM-HPC module support?

The module operates across an industrial temperature range of -40°C to 85°C and can be configured with a TDP from 45 W for power efficiency up to 120 W for maximum performance, with a base TDP of 55 W. This makes it suited for rugged edge deployments in robotics, autonomous vehicles, and industrial automation.

_Hardware teams sizing rugged edge modules can track specs like these on daily.dev._

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---

Tags: [#robotics](https://daily.dev/tags/robotics), [#local-ai](https://daily.dev/tags/local-ai)

[View this post on daily.dev](https://daily.dev/posts/congatec-launches-ryzen-ai-based-com-hpc-module-hgvaubyor)

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