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description: Efinix has launched the Titanium Edge FPGA family targeting low-power edge AI and machine vision applications. The lineup includes Ti125, Ti95, Ti70, and Ti40...
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# Efinix Titanium Edge FPGA family targets low-power edge AI and vision systems

**[CNX Software](https://daily.dev/sources/cnx-software)** · 3 min read · 2 upvotes · 0 comments

## Summary

Efinix has launched the Titanium Edge FPGA family targeting low-power edge AI and machine vision applications. The lineup includes Ti125, Ti95, Ti70, and Ti40 devices with 39K–123K logic elements, built on a 16nm TSMC process. Key features include ~50% lower static power vs. prior Titanium devices, configurable 2.5 Gbps MIPI I/O, hardware SEU detection/correction, and System-in-Package (SiP) variants integrating SPI flash and HyperRAM to reduce PCB footprint by up to 60%. Optional security features include post-quantum cryptography (ML-DSA-65/CRYSTALS-Dilithium), AES-256-GCM, RSA-4096, and PUF/TRNG. The Ti125 and Ti95 are sampling now; Ti70 and Ti40 are slated for Q4 2026. Software support is provided via the Efinity IDE v2026.1.

## Full article

daily.dev links to this article rather than hosting it. Read it at the original source: <https://www.cnx-software.com/2026/07/20/efinix-titanium-edge-fpga-family-targets-low-power-edge-ai-and-vision-systems>

## Questions this post answers

### What are the specifications of the Efinix Titanium Edge Ti125 FPGA?

The Ti125 offers up to 122,792 logic elements (109,440 XLR cells), 288 DSP blocks, 5.9 Mbit embedded SRAM, up to 36 HVIO, 62 HSIO, and 84 HSIO2 pins, MIPI CSI/DSI up to 2.5 Gbps, DDR3L support up to 1,333 Mbps, and up to 7 PLLs. It is built on a 16nm TSMC process and comes in a 225-ball FBGA package.

_daily.dev keeps hardware engineers current on new FPGA families like the Titanium Edge lineup._

### What is the difference between the Efinix Ti125 and Ti125 SiP FPGA packages?

The Ti125 SiP integrates the FPGA die with 512 Mbit HyperRAM and SPI boot flash in a single 8x8mm package, versus the standalone Ti125 in a 10x10mm package without integrated memory. This integration reduces the required PCB footprint by up to 60% compared to a discrete implementation using separate memory chips.

_Engineers evaluating compact FPGA memory integration can track releases like this via daily.dev._

### When will the Efinix Titanium Edge Ti40 and Ti70 FPGAs be available for sampling?

The Ti70 and Ti40 devices are scheduled for sampling in Q4 2026, while the Ti95 is already sampling and the Ti125 SiP sampling begins in August 2026. Efinix also plans a Ti70 SiP variant with integrated 256 Mbit HyperRAM and SPI boot flash to further reduce PCB footprint.

_daily.dev helps engineers planning FPGA-based designs stay ahead of upcoming component availability._

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---

Tags: [#embedded](https://daily.dev/tags/embedded), [#local-ai](https://daily.dev/tags/local-ai), [#fpga](https://daily.dev/tags/fpga)

[View this post on daily.dev](https://daily.dev/posts/efinix-titanium-edge-fpga-family-targets-low-power-edge-ai-and-vision-systems-ohdwzn582)

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