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# GlobalFoundries Secures $300 Million CHIPS Award for Silicon Photonics Research

**[The Quantum Insider](https://daily.dev/sources/thequantuminsider)** · 7 min read · 0 upvotes · 0 comments

## Summary

GlobalFoundries has signed a letter of intent with the U.S. Department of Commerce for a potential $300 million CHIPS R&D award to advance silicon photonics technologies and advanced packaging. The funding targets development of next-generation optical materials, wafer technologies, near-packaged optics (NPO), and co-packaged optics (CPO) for AI and high-performance computing data centers. The initiative builds on GF's SCALE™ platform, promising 400Gb/s performance and 5x energy efficiency gains over current implementations. As part of the deal, the U.S. government will receive approximately 1% equity in GF. Industry leaders from AMD, Broadcom, Cisco, NVIDIA, Meta, Microsoft, and others have publicly endorsed the investment as critical to scaling next-generation AI infrastructure.

## Full article

daily.dev links to this article rather than hosting it. Read it at the original source: <https://thequantuminsider.com/2026/07/29/globalfoundries-300-million-chips-award-silicon-photonics>

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