IMEC has expanded its 300mm RF silicon interposer platform with three new manufacturing capabilities targeting 6G chip production. The platform achieves record-low signal loss at frequencies up to 325GHz, covering millimetre-wave and sub-terahertz bands. The approach integrates compound semiconductor chiplets (indium phosphide, gallium arsenide, silicon germanium) onto standard 300mm silicon wafers via a silicon interposer, enabling mix-and-match RF chip assembly without requiring exotic substrates to scale independently. Three new capabilities — high-density embedded capacitors (MIMCAPs), a scalable passive component modelling framework, and laser-assisted bonding — address key manufacturing bottlenecks. The work is relevant to Nvidia's push into AI-native 6G telecom infrastructure, though commercial deployment remains 5–7 years away, aligning with 6G standardisation expected no earlier than 2028.
