---
title: "IMEC built a chip platform that works up to 325GHz, and it could make 6G hardware cheap enough to actually deploy"
url: https://daily.dev/posts/imec-built-a-chip-platform-that-works-up-to-325ghz-and-it-could-make-6g-hardware-cheap-enough-to-ac-gyghcrlid
source_url: https://thenextweb.com/news/imec-6g-rf-silicon-interposer-chiplet-nvidia-telecom
type: article
source: "The Next Web"
published: 2026-06-15T23:39:29.687Z
updated: 2026-06-15T23:39:49.404Z
tags: ["nvidia"]
reading_time: 4
upvotes: 0
comments: 0
language: en
---

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# IMEC built a chip platform that works up to 325GHz, and it could make 6G hardware cheap enough to actually deploy

**[The Next Web](https://daily.dev/sources/tnw)** · 4 min read · 0 upvotes · 0 comments

## Summary

IMEC has expanded its 300mm RF silicon interposer platform with three new manufacturing capabilities targeting 6G chip production. The platform achieves record-low signal loss at frequencies up to 325GHz, covering millimetre-wave and sub-terahertz bands. The approach integrates compound semiconductor chiplets (indium phosphide, gallium arsenide, silicon germanium) onto standard 300mm silicon wafers via a silicon interposer, enabling mix-and-match RF chip assembly without requiring exotic substrates to scale independently. Three new capabilities — high-density embedded capacitors (MIMCAPs), a scalable passive component modelling framework, and laser-assisted bonding — address key manufacturing bottlenecks. The work is relevant to Nvidia's push into AI-native 6G telecom infrastructure, though commercial deployment remains 5–7 years away, aligning with 6G standardisation expected no earlier than 2028.

## Full article

daily.dev links to this article rather than hosting it. Read it at the original source: <https://thenextweb.com/news/imec-6g-rf-silicon-interposer-chiplet-nvidia-telecom>

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