MIT's FUTUR-IC research program, funded by the NSF Convergence Accelerator, has developed three novel optical couplers — evanescent, GRIN, and a third led by Professor Juejun Hu — that serve as the first 'optical bumps' analogous to solder bumps in electronics. These devices enable easier and cheaper integration of photonic chips with electronic microchips within a single package, targeting a leap from hundreds of terabits per second to over 1 petabit per second in data transmission. The program also addresses sustainability concerns around semiconductor carbon emissions and e-waste, and has developed the Earthster tool for supply chain carbon analysis alongside workforce development initiatives.
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