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# Quantum-Tunnelling Field-Effect Transistor Designed to Overcome Integrated-Circuit Chip Development Barriers

**[The Quantum Insider](https://daily.dev/sources/thequantuminsider)** · 4 min read · 0 upvotes · 0 comments

## Summary

Researchers at The Hong Kong Polytechnic University, working with collaborators from several universities in Singapore, Hong Kong, and China, developed a two-dimensional tunnelling field-effect transistor (TFET) using a bismuth/indium selenide heterostructure. The device operates below the 60mV/decade Boltzmann limit that constrains conventional MOSFETs, across six orders of magnitude, while needing only a 160mV gate-voltage range versus 800mV for advanced MOSFETs. It also achieves high output current and ON/OFF ratio, and was fabricated on centimetre-scale silicon substrates using pulsed laser deposition, a method the team says is scalable for wafer-level manufacturing. The findings, published in Science, are pitched as a step toward more energy-efficient chips for AI and high-performance computing.

## Full article

daily.dev links to this article rather than hosting it. Read it at the original source: <https://thequantuminsider.com/2026/09/01/quantum-tunnelling-field-effect-transistor-designed-to-overcome-integrated-circuit-chip-development-barriers>

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