Samsung and Broadcom have signed a memorandum of understanding worth over $200 billion covering AI memory chips (HBM4 and HBM4E), foundry manufacturing at 2nm and below, and advanced packaging, running through 2030. The deal gives Broadcom supply chain diversification beyond TSMC, while helping Samsung shore up its struggling foundry business. The signing occurred at an AI summit in San Francisco alongside a broader $950 billion package of South Korean-American semiconductor deals, including SK Hynix partnerships with Nvidia worth $750 billion and Anthropic supply agreements with both Samsung and SK Hynix.
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