--- title: Samsung and Broadcom sign $200 billion chip deal... description: Samsung and Broadcom have signed a memorandum of understanding worth over $200 billion covering AI memory chips (HBM4 and HBM4E), foundry manufacturing at 2nm... canonical: https://daily.dev/posts/samsung-and-broadcom-sign-200-billion-chip-deal-spanning-memory-foundry-and-packaging-r5nmralm4 twitter:card: summary_large_image twitter:site: @dailydotdev og:type: website og:site_name: daily.dev og:title: Samsung and Broadcom sign $200 billion chip deal spanning memory, foundry and packaging | daily.dev og:description: Samsung and Broadcom have signed a memorandum of understanding worth over $200 billion covering AI memory chips (HBM4 and HBM4E), foundry manufacturing at 2nm... og:url: https://daily.dev/posts/samsung-and-broadcom-sign-200-billion-chip-deal-spanning-memory-foundry-and-packaging-r5nmralm4 og:image: https://api.daily.dev/og/posts/r5nmRaLM4.png og:image:alt: Samsung and Broadcom sign $200 billion chip deal spanning memory, foundry and packaging og:image:width: 1200 og:image:height: 630 og:locale: en --- > ## Documentation Index > Fetch the complete documentation index at: https://daily.dev/llms.txt > Use this file to discover all available pages before exploring further. # Samsung and Broadcom sign $200 billion chip deal spanning memory, foundry and packaging **[The Next Web](https://daily.dev/sources/tnw)** · 3 min read · 2 upvotes · 0 comments ## Summary Samsung and Broadcom have signed a memorandum of understanding worth over $200 billion covering AI memory chips (HBM4 and HBM4E), foundry manufacturing at 2nm and below, and advanced packaging, running through 2030. The deal gives Broadcom supply chain diversification beyond TSMC, while helping Samsung shore up its struggling foundry business. The signing occurred at an AI summit in San Francisco alongside a broader $950 billion package of South Korean-American semiconductor deals, including SK Hynix partnerships with Nvidia worth $750 billion and Anthropic supply agreements with both Samsung and SK Hynix. ## Full article daily.dev links to this article rather than hosting it. Read it at the original source: ## Similar posts on daily.dev - [South Korean tech giants commit over $550B to ease ‘ RAMageddon’](https://daily.dev/posts/south-korean-tech-giants-commit-over-550b-to-ease-ramageddon--eygiczvyh) · TechCrunch · 1 upvotes · 1 comments - [AI boom pushes Samsung to $1T](https://daily.dev/posts/ai-boom-pushes-samsung-to-1t-sd56defet) · TechCrunch · 0 upvotes · 0 comments --- Tags: [#gpu](https://daily.dev/tags/gpu), [#samsung](https://daily.dev/tags/samsung) [View this post on daily.dev](https://daily.dev/posts/samsung-and-broadcom-sign-200-billion-chip-deal-spanning-memory-foundry-and-packaging-r5nmralm4) ```json {"@context":"https://schema.org","@graph":[{"@type":"Organization","@id":"https://daily.dev/#organization","name":"daily.dev","url":"https://daily.dev","logo":{"@type":"ImageObject","url":"https://daily.dev/apple-touch-icon.png","width":180,"height":180},"sameAs":["https://twitter.com/dailydotdev","https://github.com/dailydotdev","https://www.linkedin.com/company/daily-dev-ltd"]},{"@type":"WebSite","@id":"https://daily.dev/#website","url":"https://daily.dev","name":"daily.dev","publisher":{"@id":"https://daily.dev/#organization"},"potentialAction":{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https://daily.dev/search?q={search_term_string}"},"query-input":"required name=search_term_string"}}]} {"@context":"https://schema.org","@type":"TechArticle","headline":"Samsung and Broadcom sign $200 billion chip deal spanning memory, foundry and packaging","url":"https://daily.dev/posts/samsung-and-broadcom-sign-200-billion-chip-deal-spanning-memory-foundry-and-packaging-r5nmralm4","mainEntityOfPage":{"@type":"WebPage","@id":"https://daily.dev/posts/samsung-and-broadcom-sign-200-billion-chip-deal-spanning-memory-foundry-and-packaging-r5nmralm4"},"datePublished":"2026-07-25T09:48:00.590Z","dateModified":"2026-07-25T11:40:58.019Z","description":"Samsung and Broadcom have signed a memorandum of understanding worth over $200 billion covering AI memory chips (HBM4 and HBM4E), foundry manufacturing at 2nm...","image":"https://media.daily.dev/image/upload/f_auto,q_auto/v1/posts/2fe96d738cb61f10b436b50edc9fb97c?_a=AQAEuop","thumbnailUrl":"https://media.daily.dev/image/upload/f_auto,q_auto/v1/posts/2fe96d738cb61f10b436b50edc9fb97c?_a=AQAEuop","isAccessibleForFree":true,"articleSection":"The Next Web","inLanguage":"en","publisher":{"@type":"Organization","name":"daily.dev","url":"https://daily.dev","logo":{"@type":"ImageObject","url":"https://daily.dev/apple-touch-icon.png","width":180,"height":180}},"author":{"@type":"Organization","name":"The Next Web","logo":"https://media.daily.dev/image/upload/t_logo,f_auto/v1/logos/tnw","url":"https://daily.dev/sources/tnw"},"commentCount":0,"discussionUrl":"https://daily.dev/posts/samsung-and-broadcom-sign-200-billion-chip-deal-spanning-memory-foundry-and-packaging-r5nmralm4","interactionStatistic":[{"@type":"InteractionCounter","interactionType":{"@type":"LikeAction"},"userInteractionCount":2},{"@type":"InteractionCounter","interactionType":{"@type":"CommentAction"},"userInteractionCount":0}],"keywords":"gpu,samsung","timeRequired":"PT3M"} {"@context":"https://schema.org","@type":"BreadcrumbList","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https://daily.dev"},{"@type":"ListItem","position":2,"name":"The Next Web","item":"https://daily.dev/sources/tnw"},{"@type":"ListItem","position":3,"name":"Samsung and Broadcom sign $200 billion chip deal spanning memory, foundry and packaging"}]} ```