--- title: Samsung and Broadcom sign $200 billion chip deal... description: Samsung and Broadcom have signed a memorandum of understanding worth over $200 billion covering AI memory chips (HBM4 and HBM4E), foundry manufacturing at 2nm... canonical: https://daily.dev/posts/samsung-and-broadcom-sign-200-billion-chip-deal-spanning-memory-foundry-and-packaging-r5nmralm4 twitter:card: summary_large_image twitter:site: @dailydotdev og:type: website og:site_name: daily.dev og:title: Samsung and Broadcom sign $200 billion chip deal spanning memory, foundry and packaging | daily.dev og:description: Samsung and Broadcom have signed a memorandum of understanding worth over $200 billion covering AI memory chips (HBM4 and HBM4E), foundry manufacturing at 2nm... og:url: https://daily.dev/posts/samsung-and-broadcom-sign-200-billion-chip-deal-spanning-memory-foundry-and-packaging-r5nmralm4 og:image: https://api.daily.dev/og/posts/r5nmRaLM4.png og:image:alt: Samsung and Broadcom sign $200 billion chip deal spanning memory, foundry and packaging og:image:width: 1200 og:image:height: 630 og:locale: en --- > ## Documentation Index > Fetch the complete documentation index at: https://daily.dev/llms.txt > Use this file to discover all available pages before exploring further. # Samsung and Broadcom sign $200 billion chip deal spanning memory, foundry and packaging **[The Next Web](https://daily.dev/sources/tnw)** · 3 min read · 2 upvotes · 0 comments ## Summary Samsung and Broadcom have signed a memorandum of understanding worth over $200 billion covering AI memory chips (HBM4 and HBM4E), foundry manufacturing at 2nm and below, and advanced packaging, running through 2030. The deal gives Broadcom supply chain diversification beyond TSMC, while helping Samsung shore up its struggling foundry business. The signing occurred at an AI summit in San Francisco alongside a broader $950 billion package of South Korean-American semiconductor deals, including SK Hynix partnerships with Nvidia worth $750 billion and Anthropic supply agreements with both Samsung and SK Hynix. ## Full article daily.dev links to this article rather than hosting it. Read it at the original source: ## Questions this post answers ### What did Samsung and Broadcom agree to in their new chip deal? Samsung and Broadcom signed a memorandum of understanding worth more than $200 billion covering memory, foundry manufacturing, and advanced packaging for AI semiconductors, running five years through 2030. Samsung will supply HBM4 and HBM4E high-bandwidth memory for Broadcom's AI accelerators and manufacture Broadcom chips using two-nanometer and smaller processes at its Pyeongtaek, South Korea campus. _Track how AI chip supply deals like this reshape hardware roadmaps with daily.dev._ ### Why is Broadcom diversifying its chip manufacturing away from TSMC? Broadcom is adding Samsung as a foundry partner to gain supply chain resilience, since TSMC currently controls more than 90 percent of leading-edge chip production. Broadcom designs custom AI chips for hyperscalers like Google and Meta, and spreading manufacturing across two major foundries reduces its dependence on a single supplier for advanced nodes. _daily.dev helps engineers follow supply chain shifts affecting AI accelerator sourcing._ ### How much is Samsung's foundry market share compared to TSMC? Samsung's global foundry market share has fallen to roughly seven percent while TSMC dominates the leading-edge chip manufacturing market. Samsung has also struggled with yields on its two-nanometer process, making the $200 billion Broadcom commitment significant for restoring investor confidence in its ability to compete at the leading edge. _Developers weighing foundry reliability for AI silicon can follow these shifts on daily.dev._ ## Similar posts on daily.dev - [South Korean tech giants commit over $550B to ease ‘ RAMageddon’](https://daily.dev/posts/south-korean-tech-giants-commit-over-550b-to-ease-ramageddon--eygiczvyh) · TechCrunch · 1 upvotes · 1 comments - [AI boom pushes Samsung to $1T](https://daily.dev/posts/ai-boom-pushes-samsung-to-1t-sd56defet) · TechCrunch · 0 upvotes · 0 comments - [Samsung Electronics crosses $1tn, joining TSMC](https://daily.dev/posts/samsung-electronics-crosses-1tn-joining-tsmc-xj4len54h) · The Next Web · 0 upvotes · 0 comments - [Apple commits $30bn to Broadcom for US-made chips](https://daily.dev/posts/apple-commits-30bn-to-broadcom-for-us-made-chips-dk2fizt8k) · The Next Web · 1 upvotes · 0 comments --- Tags: [#gpu](https://daily.dev/tags/gpu), [#samsung](https://daily.dev/tags/samsung) [View this post on daily.dev](https://daily.dev/posts/samsung-and-broadcom-sign-200-billion-chip-deal-spanning-memory-foundry-and-packaging-r5nmralm4) ```json {"@context":"https://schema.org","@graph":[{"@type":"Organization","@id":"https://daily.dev/#organization","name":"daily.dev","url":"https://daily.dev","logo":{"@type":"ImageObject","url":"https://daily.dev/apple-touch-icon.png","width":180,"height":180},"sameAs":["https://twitter.com/dailydotdev","https://github.com/dailydotdev","https://www.linkedin.com/company/daily-dev-ltd"]},{"@type":"WebSite","@id":"https://daily.dev/#website","url":"https://daily.dev","name":"daily.dev","publisher":{"@id":"https://daily.dev/#organization"},"potentialAction":{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https://daily.dev/search?q={search_term_string}"},"query-input":"required name=search_term_string"}}]} {"@context":"https://schema.org","@type":"TechArticle","headline":"Samsung and Broadcom sign $200 billion chip deal spanning memory, foundry and packaging","url":"https://daily.dev/posts/samsung-and-broadcom-sign-200-billion-chip-deal-spanning-memory-foundry-and-packaging-r5nmralm4","mainEntityOfPage":{"@type":"WebPage","@id":"https://daily.dev/posts/samsung-and-broadcom-sign-200-billion-chip-deal-spanning-memory-foundry-and-packaging-r5nmralm4"},"datePublished":"2026-07-25T09:48:00.590Z","dateModified":"2026-09-13T19:54:13.222Z","description":"Samsung and Broadcom have signed a memorandum of understanding worth over $200 billion covering AI memory chips (HBM4 and HBM4E), foundry manufacturing at 2nm...","image":"https://media.daily.dev/image/upload/f_auto,q_auto/v1/posts/2fe96d738cb61f10b436b50edc9fb97c?_a=AQAEuop","thumbnailUrl":"https://media.daily.dev/image/upload/f_auto,q_auto/v1/posts/2fe96d738cb61f10b436b50edc9fb97c?_a=AQAEuop","isAccessibleForFree":true,"articleSection":"The Next Web","inLanguage":"en","publisher":{"@type":"Organization","name":"daily.dev","url":"https://daily.dev","logo":{"@type":"ImageObject","url":"https://daily.dev/apple-touch-icon.png","width":180,"height":180}},"author":{"@type":"Organization","name":"The Next Web","logo":"https://media.daily.dev/image/upload/t_logo,f_auto/v1/logos/tnw","url":"https://daily.dev/sources/tnw"},"commentCount":0,"discussionUrl":"https://daily.dev/posts/samsung-and-broadcom-sign-200-billion-chip-deal-spanning-memory-foundry-and-packaging-r5nmralm4","interactionStatistic":[{"@type":"InteractionCounter","interactionType":{"@type":"LikeAction"},"userInteractionCount":2},{"@type":"InteractionCounter","interactionType":{"@type":"CommentAction"},"userInteractionCount":0}],"keywords":"gpu,samsung","timeRequired":"PT3M"} {"@context":"https://schema.org","@type":"BreadcrumbList","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https://daily.dev"},{"@type":"ListItem","position":2,"name":"The Next Web","item":"https://daily.dev/sources/tnw"},{"@type":"ListItem","position":3,"name":"Samsung and Broadcom sign $200 billion chip deal spanning memory, foundry and packaging"}]} {"@context":"https://schema.org","@type":"FAQPage","@id":"https://daily.dev/posts/samsung-and-broadcom-sign-200-billion-chip-deal-spanning-memory-foundry-and-packaging-r5nmralm4#faq","mainEntity":[{"@type":"Question","name":"What did Samsung and Broadcom agree to in their new chip deal?","acceptedAnswer":{"@type":"Answer","text":"Samsung and Broadcom signed a memorandum of understanding worth more than $200 billion covering memory, foundry manufacturing, and advanced packaging for AI semiconductors, running five years through 2030. Samsung will supply HBM4 and HBM4E high-bandwidth memory for Broadcom's AI accelerators and manufacture Broadcom chips using two-nanometer and smaller processes at its Pyeongtaek, South Korea campus. Track how AI chip supply deals like this reshape hardware roadmaps with daily.dev."}},{"@type":"Question","name":"Why is Broadcom diversifying its chip manufacturing away from TSMC?","acceptedAnswer":{"@type":"Answer","text":"Broadcom is adding Samsung as a foundry partner to gain supply chain resilience, since TSMC currently controls more than 90 percent of leading-edge chip production. Broadcom designs custom AI chips for hyperscalers like Google and Meta, and spreading manufacturing across two major foundries reduces its dependence on a single supplier for advanced nodes. daily.dev helps engineers follow supply chain shifts affecting AI accelerator sourcing."}},{"@type":"Question","name":"How much is Samsung's foundry market share compared to TSMC?","acceptedAnswer":{"@type":"Answer","text":"Samsung's global foundry market share has fallen to roughly seven percent while TSMC dominates the leading-edge chip manufacturing market. Samsung has also struggled with yields on its two-nanometer process, making the $200 billion Broadcom commitment significant for restoring investor confidence in its ability to compete at the leading edge. Developers weighing foundry reliability for AI silicon can follow these shifts on daily.dev."}}]} ```