--- title: Stacking Chips Sideways Gives AI More Memory | daily.dev description: Researchers are exploring sideways or vertical DRAM die stacking as an alternative to traditional tall HBM stacks, which face thermal and bandwidth... canonical: https://daily.dev/posts/stacking-chips-sideways-gives-ai-more-memory-iupz08vne twitter:card: summary_large_image twitter:site: @dailydotdev og:type: website og:site_name: daily.dev og:title: Stacking Chips Sideways Gives AI More Memory | daily.dev og:description: Researchers are exploring sideways or vertical DRAM die stacking as an alternative to traditional tall HBM stacks, which face thermal and bandwidth... og:url: https://daily.dev/posts/stacking-chips-sideways-gives-ai-more-memory-iupz08vne og:image: https://api.daily.dev/og/posts/iUPZ08VnE.png og:image:alt: Stacking Chips Sideways Gives AI More Memory og:image:width: 1200 og:image:height: 630 og:locale: en --- > ## Documentation Index > Fetch the complete documentation index at: https://daily.dev/llms.txt > Use this file to discover all available pages before exploring further. # Stacking Chips Sideways Gives AI More Memory **[IEEE Spectrum](https://daily.dev/sources/ieeespectrum)** · 6 min read · 0 upvotes · 0 comments ## Summary Researchers are exploring sideways or vertical DRAM die stacking as an alternative to traditional tall HBM stacks, which face thermal and bandwidth limitations. Two approaches were presented at IEEE VLSI Symposium: V-Die from South Korean researchers at UNIST, which eliminates through-silicon vias to free up memory cell area and predicts an 82% speed boost over HBM4 with microfluidic cooling keeping dies at 45°C; and MOSAIC from Japanese universities, which uses inductive coupling transceivers to ease alignment tolerances and can fit 98 dies per cube for 294 GB, potentially scaling to 882 GB with thinner dies. Both aim to address the growing memory bottleneck for large AI models while managing heat more effectively than current vertical stacking approaches. ## Full article daily.dev links to this article rather than hosting it. Read it at the original source: ## Similar posts on daily.dev - [The Ultimate 3D Integration Would Cook Future GPUs](https://daily.dev/posts/the-ultimate-3d-integration-would-cook-future-gpus-9hvxqehxv) · IEEE Spectrum · 0 upvotes · 0 comments - [The $100B memory war: Inside the battle for AI's future](https://daily.dev/posts/the-100b-memory-war-inside-the-battle-for-ai-s-future-zppmgogcw) · The Register · 0 upvotes · 0 comments --- Tags: [#hardware](https://daily.dev/tags/hardware), [#gpu](https://daily.dev/tags/gpu) [View this post on daily.dev](https://daily.dev/posts/stacking-chips-sideways-gives-ai-more-memory-iupz08vne) ```json {"@context":"https://schema.org","@graph":[{"@type":"Organization","@id":"https://daily.dev/#organization","name":"daily.dev","url":"https://daily.dev","logo":{"@type":"ImageObject","url":"https://daily.dev/apple-touch-icon.png","width":180,"height":180},"sameAs":["https://twitter.com/dailydotdev","https://github.com/dailydotdev","https://www.linkedin.com/company/daily-dev-ltd"]},{"@type":"WebSite","@id":"https://daily.dev/#website","url":"https://daily.dev","name":"daily.dev","publisher":{"@id":"https://daily.dev/#organization"},"potentialAction":{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https://daily.dev/search?q={search_term_string}"},"query-input":"required name=search_term_string"}}]} {"@context":"https://schema.org","@type":"TechArticle","headline":"Stacking Chips Sideways Gives AI More Memory","url":"https://daily.dev/posts/stacking-chips-sideways-gives-ai-more-memory-iupz08vne","mainEntityOfPage":{"@type":"WebPage","@id":"https://daily.dev/posts/stacking-chips-sideways-gives-ai-more-memory-iupz08vne"},"datePublished":"2026-07-08T10:04:11.114Z","dateModified":"2026-07-08T10:04:32.462Z","description":"Researchers are exploring sideways or vertical DRAM die stacking as an alternative to traditional tall HBM stacks, which face thermal and bandwidth...","image":"https://media.daily.dev/image/upload/f_auto,q_auto/v1/posts/19e3bdb69cd333a34646f7cc3b782062?_a=AQAEuop","thumbnailUrl":"https://media.daily.dev/image/upload/f_auto,q_auto/v1/posts/19e3bdb69cd333a34646f7cc3b782062?_a=AQAEuop","isAccessibleForFree":true,"articleSection":"IEEE Spectrum","inLanguage":"en","publisher":{"@type":"Organization","name":"daily.dev","url":"https://daily.dev","logo":{"@type":"ImageObject","url":"https://daily.dev/apple-touch-icon.png","width":180,"height":180}},"author":{"@type":"Organization","name":"IEEE Spectrum","logo":"https://media.daily.dev/image/upload/t_logo,f_auto/v1/logos/b123f5e8420e492ab36f6adb30c1793a","url":"https://daily.dev/sources/ieeespectrum"},"commentCount":0,"discussionUrl":"https://daily.dev/posts/stacking-chips-sideways-gives-ai-more-memory-iupz08vne","interactionStatistic":[{"@type":"InteractionCounter","interactionType":{"@type":"LikeAction"},"userInteractionCount":0},{"@type":"InteractionCounter","interactionType":{"@type":"CommentAction"},"userInteractionCount":0}],"keywords":"hardware,gpu","timeRequired":"PT6M"} {"@context":"https://schema.org","@type":"BreadcrumbList","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https://daily.dev"},{"@type":"ListItem","position":2,"name":"IEEE Spectrum","item":"https://daily.dev/sources/ieeespectrum"},{"@type":"ListItem","position":3,"name":"Stacking Chips Sideways Gives AI More Memory"}]} ```