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# TSMC breaks ground on more advanced packaging fabs in Chiayi

**[The Next Web](https://daily.dev/sources/tnw)** · 4 min read · 0 upvotes · 0 comments

## Summary

TSMC is expanding its advanced packaging capacity with three new facilities in Phase II of the Chiayi Science Park in southern Taiwan. Two Phase I facilities are already in mass production. The expansion targets high-performance computing and AI accelerator demand, specifically TSMC's CoWoS packaging process, which integrates logic dies and stacked memory and has been a supply bottleneck for two years. Once both phases are complete, the park is expected to generate over $9.35bn in annual output and support 9,000 jobs. The announcement coincided with TSMC reporting record Q2 revenue of $39.62bn, up 36% year-on-year, making it Asia's most valuable listed company at ~$1.96tn market cap.

## Full article

daily.dev links to this article rather than hosting it. Read it at the original source: <https://thenextweb.com/news/tsmc-chiayi-advanced-packaging-phase-two>

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