MIT researchers have developed a scalable, two-step fabrication platform that integrates delicate molecular materials into electronic devices on a chip without damage. The technique first prefabricates device components using standard semiconductor processes, then introduces molecules and uses nanoscale capillary and van der Waals forces to self-assemble the final structure. Over 1,000 devices were fabricated with sub-nanometer molecular layers, achieving 96% yield and surviving tens of thousands of electrical cycles without degradation. The platform enables circuit- and system-level integration, including molecular memory arrays, and could accelerate development of next-generation computing, sensing, and quantum technologies.
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